A modular jack has a magnetic assembly including insulative body, two rows of terminals retained to the insulative body, four transformers, and four common mode chokes. Each of the transformer and common mode choke includes a magnetic core and a plurality of conductive wires wound therearound. Each terminal has a recess for receiving an end portions of a corresponding wire and then the terminal is inserted into a through-hole of an internal printed circuit board for dip soldering. Guiding of the wire to the recess can be automated in contrast to manual winding operation.