An electronic apparatus capable of reducing assembly man-hours to reduce fabrication costs and capable of improving appearance design thereof. An upper cover of the electronic apparatus has a first abutment portion abutted with a second abutment portion of a right cover. Engagement portions are formed on an inner face of the upper cover, and latch portions are disposed between adjacent ones of the engagement portions and provided to project toward the right cover beyond the first abutment portion. The right cover has engaged portions disposed along the second abutment portion and provided to project toward the upper cover beyond the second abutment portion, and latched portions are disposed between adjacent ones of the engaged portions. The engaged portions of the right cover are engaged with the engagement portions of the upper cover, and the latched portions of the right cover are latched to the latch portions of the upper cover.