Invention Grant
- Patent Title: Image pickup apparatus having imaging sensor package
- Patent Title (中): 具有成像传感器封装的图像拾取装置
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Application No.: US13616755Application Date: 2012-09-14
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Publication No.: US09386198B2Publication Date: 2016-07-05
- Inventor: Norikazu Hirota
- Applicant: Norikazu Hirota
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2011-207292 20110922
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
An image pickup apparatus in which an imaging sensor package reflow mounted in advance to a circuit board can be fixed to a fixture member of the image pickup apparatus. A sensor holder of a digital video camera as an image pickup apparatus has a holder body that is positioned to surround an imaging sensor package mounted to a sensor board as a circuit board. Flange portions of the sensor holder are formed to project from a rear end surface of the holder body toward a heat radiation plate having a flat plate shape. The heat radiation plate is fixed to a lens barrel in a state that the flange portions are held between the lens barrel and the heat radiation plate.
Public/Granted literature
- US20130076977A1 IMAGE PICKUP APPARATUS HAVING IMAGING SENSOR PACKAGE Public/Granted day:2013-03-28
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