Invention Grant
- Patent Title: Camera module and electronic device for cooling image sensor
- Patent Title (中): 相机模块和用于冷却图像传感器的电子设备
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Application No.: US13955703Application Date: 2013-07-31
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Publication No.: US09386200B2Publication Date: 2016-07-05
- Inventor: Kazuhiro Hongo
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2012-186140 20120827
- Main IPC: F03G7/06
- IPC: F03G7/06 ; H05K7/00 ; H04N5/225

Abstract:
There is provided a camera module including an image sensor unit that is configured to include an image sensor and a mounting board, a sheet-shaped heat radiation member that comes into contact with a part of the image sensor unit and a component other than the image sensor unit and is elastically deformed so that an imaging surface of the image sensor unit is moved, and an actuator that elastically deforms the sheet-shaped heat radiation member so that the imaging surface of the image sensor unit is moved.
Public/Granted literature
- US20140055670A1 CAMERA MODULE AND ELECTRONIC DEVICE Public/Granted day:2014-02-27
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