The present disclosure relates to a camera device and an electronic device. The camera device comprises a rigid circuit board, an image sensor, and a heat dissipation member. The rigid circuit board comprises an extension portion extending laterally and a plurality of electrical contact pads. The extension portion comprises a board edge. The plurality of electrical contact pads are provided on the board edge. The image sensor comprises an image capture chip. The image capture chip may be directly fixed on the rigid circuit board, a heat dissipation space is left at a position which is below the rigid circuit board and corresponds to the image sensor when the board edge of the rigid circuit board is mated to a board edge connector of laterally connected type provided at one side of a main circuit board. The heat dissipation member may be provided in the heat dissipation space.