Invention Grant
- Patent Title: Interposer and semiconductor module using the same
- Patent Title (中): 内插器和半导体模块使用相同
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Application No.: US13977908Application Date: 2011-12-28
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Publication No.: US09386685B2Publication Date: 2016-07-05
- Inventor: Manabu Bonkohara
- Applicant: Manabu Bonkohara
- Applicant Address: JP Yokohama-shi
- Assignee: ZYCUBE CO., LTD.
- Current Assignee: ZYCUBE CO., LTD.
- Current Assignee Address: JP Yokohama-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-294618 20101230
- International Application: PCT/JP2011/080528 WO 20111228
- International Announcement: WO2012/091140 WO 20120705
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/34 ; H01L23/498 ; H01L25/065 ; H05K7/20 ; H01L23/467 ; H01L23/473 ; H01L23/00
Abstract:
An interposer is provided that suppresses heat conduction more effectively between two heat sources when the interposer is placed between the heat sources.An interposer 24 comprises a body having a cavity 23 maintained in vacuum; insulating layers 22a and 22b formed respectively on upper and lower walls 20a and 20b of the body; and heat reflecting layers 21a and 21b formed respectively on the insulating layers 22a and 22b. The interposer 24 thermally insulates semiconductor devices 11a and 21a mounted respectively on upper and lower sides of the interposer 24.
Public/Granted literature
- US20140016270A1 INTERPOSER AND SEMICONDUCTOR MODULE USING THE SAME Public/Granted day:2014-01-16
Information query
