Invention Grant
- Patent Title: Circuit board
- Patent Title (中): 电路板
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Application No.: US14611535Application Date: 2015-02-02
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Publication No.: US09386689B2Publication Date: 2016-07-05
- Inventor: Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2010-051086 20100308
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H01P3/00

Abstract:
A structure (10) includes at least three conductors (111, 131, 151) that are opposed to each other, a penetration via (101) that penetrates the conductors (111, 131, 151), openings (112, 152) that are formed so as to surround the penetration via (101), and conductor elements (121, 141) that are located in layers other than the layers in which the conductors (111, 131, 151) are located and that are connected to the penetration via (101). The conductor element (121) larger than the opening (112) is opposed to the opening (112) and the conductor element (141) larger than the opening (152) is opposed to the opening (152).
Public/Granted literature
- US20150144393A1 CIRCUIT BOARD Public/Granted day:2015-05-28
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