Invention Grant
- Patent Title: Board integrated interconnect
- Patent Title (中): 板集成互连
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Application No.: US14269736Application Date: 2014-05-05
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Publication No.: US09386693B2Publication Date: 2016-07-05
- Inventor: Tim Gruhl
- Applicant: Tim Gruhl
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Baker Botts L.L.P.
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/03 ; H05K1/00 ; H05K1/02 ; H05K3/46 ; B29C67/00 ; H01L21/48 ; H05K3/40 ; B29L31/34 ; H05K3/12
Abstract:
In an embodiment, a method includes forming a printed circuit board by depositing a first plurality of layers and forming an interconnect integral to the printed circuit board by depositing a second plurality of layers on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure and a contact positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material.
Public/Granted literature
- US20150319850A1 Board Integrated Interconnect Public/Granted day:2015-11-05
Information query
