A module comprises a first insulating-substrate-side member that has a first insulating substrate, a first conductor layer provided on the first insulating substrate, and a first electronic element provided on the first conductor layer; a second insulating-substrate-side member that has a second insulating substrate, a second conductor layer provided on a lower side of the second insulating substrate, and a second electronic element provided on a lower side of the second conductor layer; and a sealing member that is provided between the first insulating substrate and the second insulating substrate. The first electronic element and the second electronic element are opposingly disposed. The first electronic element and the second electronic element are connected by an element connecting conductor post that has electric conductivity.