An electronic device comprises a substrate (120), at least one electronic component (171, 172, 173) arranged on the substrate, and an encapsulation (140) covering the at least one electronic component (171, 172, 173). An electromagnetic protective layer (130) covers a surface (143) of the encapsulation (140) that faces away from the substrate (120), and the side faces (121, 141; 122, 142) directed transversely with respect to the surface (143). In particular, a thermal and/or electrical coupling (134, 162, 163, 164, 165, 166) couples the electromagnetic protective layer (130) thermally and/or electrically to a region (168) of the electronic device (111, 112) that is enclosed by the encapsulation. For production purposes, the device is singulated from a panel and the electromagnetic protective layer (130) is subsequently applied.