An electronic component mounting apparatus includes a loading unit which loads a printed circuit board. This apparatus includes a first substrate moving unit which moves the printed circuit board, loaded by the loading unit, in the Y-direction. This apparatus includes a substrate holding unit which temporarily holds the printed circuit board moved by the first substrate moving unit. This apparatus includes a component mounting unit which mounts an electronic component on the printed circuit board. This apparatus includes a second substrate moving unit which moves the printed circuit board with the electronic component mounted thereon in the Y-direction. This apparatus includes an unloading unit which moves the printed circuit board, moved by the second substrate moving unit, in the X-direction to unload it. This invention can provide an electronic component mounting apparatus which is compact in its conveyance direction for conveying a printed circuit board.