A fluid handling device includes a substrate, a film and a conductive layer. The substrate includes a through hole or a recess. The film includes first, second and third regions. The conductive layer is disposed on one surface of the film across the first, second and third regions. The first region of the film is bonded to one surface of the substrate such that one of openings of the through hole or an opening of the recess is closed to form a housing part, and that a part of the conductive layer is exposed to the inside of the housing part. The second region of the film is bent such that the conductive layer is located on an outside. The third region of the film is bonded to the first region of the film such that the conductive layer is exposed to the exterior.