Invention Grant
- Patent Title: Wire harness and method of manufacturing the same
- Patent Title (中): 线束及其制造方法
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Application No.: US13994795Application Date: 2011-12-28
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Publication No.: US09387816B2Publication Date: 2016-07-12
- Inventor: Eiichi Toyama
- Applicant: Eiichi Toyama
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-292018 20101228
- International Application: PCT/JP2011/080593 WO 20111228
- International Announcement: WO2012/091171 WO 20120705
- Main IPC: B60R16/02
- IPC: B60R16/02 ; H01B13/012 ; H01R43/00 ; H01B7/40
Abstract:
A wire harness includes a conductive path and a route holding portion that holds a route of the conductive path. The route holding portion has a cylindrical shape and is comprised of a watercrosslinkable fixing member or a photocrosslinkable fixing member having elastic so that the route holding portion is elastically deformed at least in a radial direction thereof.
Public/Granted literature
- US20130264114A1 WIRE HARNESS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-10-10
Information query
