Invention Grant
- Patent Title: Micro-electro-mechanical device with buried conductive regions, and manufacturing process thereof
- Patent Title (中): 具有埋地导电区域的微机电装置及其制造方法
-
Application No.: US14265116Application Date: 2014-04-29
-
Publication No.: US09388038B2Publication Date: 2016-07-12
- Inventor: Roberto Campedelli , Raffaella Pezzuto , Stefano Losa , Marco Mantovani , Mikel Azpeitia Urquia
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed Intellectual Property Law Group PLLC
- Priority: ITTO2011A0995 20111031
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; B81B3/00 ; B81C1/00
Abstract:
A MEMS device formed by a body; a cavity, extending above the body; mobile and fixed structures extending above the cavity and physically connected to the body via anchoring regions; and electrical-connection regions, extending between the body and the anchoring regions and electrically connected to the mobile and fixed structures. The electrical-connection regions are formed by a conductive multilayer including a first semiconductor material layer, a composite layer of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer.
Public/Granted literature
- US20140231938A1 MICRO-ELECTRO-MECHANICAL DEVICE WITH BURIED CONDUCTIVE REGIONS, AND MANUFACTURING PROCESS THEREOF Public/Granted day:2014-08-21
Information query
IPC分类:
