Invention Grant
- Patent Title: Microcup compositions
- Patent Title (中): 微型组合物
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Application No.: US13686778Application Date: 2012-11-27
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Publication No.: US09388307B2Publication Date: 2016-07-12
- Inventor: Yu Li , HongMei Zang
- Applicant: SiPix Imaging, Inc.
- Applicant Address: US CA Fremont
- Assignee: E INK CALIFORNIA, LLC
- Current Assignee: E INK CALIFORNIA, LLC
- Current Assignee Address: US CA Fremont
- Agency: Perkins Coie LLP
- Main IPC: C09K19/00
- IPC: C09K19/00 ; C08L33/06 ; C08L33/14 ; G02F1/167 ; C09J133/14 ; B32B7/06 ; B32B7/12 ; B32B27/06 ; B32B27/16 ; B29C39/02 ; B29C59/02
Abstract:
The present invention is directed to a composition for preparing the microcups and the toughness of the display panel formed from such a composition may be significantly improved. In some cases, the panel may have an elongation at break of more than 10% and it can be completely peeled off from the substrate layer on which it is formed, without causing any damage to the panel.
Public/Granted literature
- US20140147478A1 MICROCUP COMPOSITIONS Public/Granted day:2014-05-29
Information query
