Disclosed are methods and apparatuses for overcoming known plating deficiencies in evaporator assemblies in ice making machine. One embodiment joins the vertical and horizontal partitions together at their intersections so that all surfaces are susceptible for increased soldering/brazing by eliminating the “voids” by changing the location and design of the “weep holes” in the vertical and/or horizontal partitions. This provides more complete capillary path at the joint between the vertical and horizontal partitions and the evaporator pan allowing improved flow via capillary action of solder/brazing alloy during the joining of the assembled vertical and horizontal partition grid to the evaporator pan. Another embodiment increases the clearance between the partitions at their intersections to allow the post-joining plating treatment to penetrate and coat all the partition surfaces by widening the intersection slots in the partitions, but including “stand-off” features to center the mating partition in the widened intersection slot.