Invention Grant
- Patent Title: Interconnect bridge assembly for photonic integrated circuits
- Patent Title (中): 用于光子集成电路的互连桥式组件
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Application No.: US13855552Application Date: 2013-04-02
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Publication No.: US09389441B2Publication Date: 2016-07-12
- Inventor: David Gerald Coult , Radhakrishnan L. Nagarajan , Jiaming Zhang , Joseph Edward Riska , Donald J. Pavinski, Jr. , Jie Tang , Timothy Butrie
- Applicant: Infinera Corp.
- Applicant Address: US CA Sunnyvale
- Assignee: Infinera Corporation
- Current Assignee: Infinera Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Dunlap Codding PC
- Agent David L. Soltz
- Main IPC: H04B10/00
- IPC: H04B10/00 ; H04B10/04 ; H04B10/06 ; G02F1/03

Abstract:
A photonic transmitter, comprises a modulator driver having a first and second output ports, a photonic integrated transmitter circuit having a modulator having a first and a second input line, and a first input port electrically coupled with the first input line and a second input port electrically coupled with the second input line, and an interconnect bridge assembly, including a first termination resistor, a second termination resistor, and a substrate. An impedance-controlled transmission structure is formed in the substrate, and has: (a) an impedance control section including a first and a second signal lines electrically insulated from one another; and (b) a transmission section including a third and a fourth signal line coupled with termination resistor. The interconnect bridge assembly transmits an impedance controlled differential electrical signal from the modulator driver to the modulator, and transmits the electrical signal from the modulator to the first and second termination resistors.
Public/Granted literature
- US20150180580A1 Interconnect Bridge Assembly for Photonic Integrated Circuits Public/Granted day:2015-06-25
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