Invention Grant
- Patent Title: Manufacturing method of conductive sheet and conductive sheet
- Patent Title (中): 导电片和导电片的制造方法
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Application No.: US14706564Application Date: 2015-05-07
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Publication No.: US09389503B2Publication Date: 2016-07-12
- Inventor: Tsukasa Tokunaga , Shin Tajiri , Makoto Sutou , Toshinari Fujii , Shinichi Nakahira , Kensuke Katagiri , Nozomu Tonoike
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-248249 20121112; JP2013-121727 20130610
- Main IPC: G03C1/047
- IPC: G03C1/047 ; G03C1/053 ; H05K3/00 ; G03F7/004 ; G03F7/20 ; G03F7/16 ; G03F7/40 ; H05K3/10

Abstract:
A manufacturing method of a conductive sheet includes: a step A of forming a silver halide-containing photosensitive layer, which contains silver halide, gelatin, and a polymer different from the gelatin and in which a mass ratio (Y/X) of a mass Y of the polymer to a mass X of the gelatin is equal to or greater than 0.1, on a support; a step B of forming conductive portions containing metal silver by performing exposure and then development treatment on the silver halide-containing photosensitive layer; and a step C of treating the support having the conductive portions with an oxidant which has a standard electrode potential of equal to or greater than +1.5 V and decomposes the gelatin.
Public/Granted literature
- US20150234271A1 MANUFACTURING METHOD OF CONDUCTIVE SHEET AND CONDUCTIVE SHEET Public/Granted day:2015-08-20
Information query
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