Invention Grant
US09390974B2 Back-to-back stacked integrated circuit assembly and method of making
有权
背对背堆叠集成电路组件及其制作方法
- Patent Title: Back-to-back stacked integrated circuit assembly and method of making
- Patent Title (中): 背对背堆叠集成电路组件及其制作方法
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Application No.: US13725403Application Date: 2012-12-21
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Publication No.: US09390974B2Publication Date: 2016-07-12
- Inventor: Michael A. Stuber , Stuart B. Molin
- Applicant: QUALCOMM SWITCH CORP.
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/78 ; H01L25/065 ; H01L25/00 ; H01L21/683 ; H01L23/00
Abstract:
An integrated circuit assembly includes a first substrate and a second substrate, with active layers formed on the first surfaces of each substrate, and with the second surfaces of each substrate coupled together. A method of fabricating an integrated circuit assembly includes forming active layers on the first surfaces of each of two substrates, and coupling the second surfaces of the substrates together.
Public/Granted literature
- US20140175637A1 Back-to-back stacked integrated circuit assembly and method of making Public/Granted day:2014-06-26
Information query
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