Invention Grant
- Patent Title: Solder balls and semiconductor device employing the same
- Patent Title (中): 焊球和采用该焊球的半导体器件
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Application No.: US14446788Application Date: 2014-07-30
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Publication No.: US09391039B2Publication Date: 2016-07-12
- Inventor: Jeong Tak Moon , Jae Yeol Son , Santosh Kumar , Eung Jae Kim , Hui Joong Kim , Ho Gun Cha
- Applicant: MK Electron Co., Ltd.
- Applicant Address: KR
- Assignee: MK Electron Co., Ltd.
- Current Assignee: MK Electron Co., Ltd.
- Current Assignee Address: KR
- Agency: Brinks Gilson & Lione
- Priority: KR10-2014-0081222 20140630
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01B1/02
Abstract:
A solder ball and a semiconductor device using the same are provided. In a Sn-based solder ball in which a first plating layer and a second plating layer are sequentially formed on a core ball, the second plating layer includes a Sn—Ag—Cu alloy, and Ag3Sn intermetallic compound (IMC) nanoparticles or Ag—Sn compound nanoparticles exist in the second plating layer. The solder balls have high sphericity and stand-off characteristics and connection reliability so that a semiconductor device having a high degree of integration may be implemented.
Public/Granted literature
- US20150380373A1 SOLDER BALLS AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME Public/Granted day:2015-12-31
Information query
IPC分类:
