Invention Grant
US09391040B2 Planarity-tolerant reworkable interconnect with integrated testing
有权
平面容错的可重复工作互连，集成测试
- Patent Title: Planarity-tolerant reworkable interconnect with integrated testing
- Patent Title (中): 平面容错的可重复工作互连，集成测试
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Application No.: US14516963Application Date: 2014-10-17
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Publication No.: US09391040B2Publication Date: 2016-07-12
- Inventor: Bing Dang , John U. Knickerbocker , Yang Liu , Yu Luo , Steven L. Wright
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Louis J. Percello, Esq.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/498 ; H01L21/56 ; H01L23/31 ; H01L21/683 ; H01L21/66
Abstract:
A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.
Public/Granted literature
- US20160111387A1 PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING Public/Granted day:2016-04-21
Information query
IPC分类:
