Invention Grant
- Patent Title: Microphone on printed circuit board (PCB)
- Patent Title (中): 印刷电路板（PCB）上的麦克风
-
Application No.: US14089649Application Date: 2013-11-25
-
Publication No.: US09392376B2Publication Date: 2016-07-12
- Inventor: Aleksey S. Khenkin , Anthony D. Minervini
- Applicant: Invensense, Inc.
- Applicant Address: US CA San Jose
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA San Jose
- Agency: IPxLaw Group LLP
- Agent Maryam Imam
- Main IPC: H04R3/00
- IPC: H04R3/00 ; H04R19/04
Abstract:
A MEMS device includes a MEM-CMOS module having a CMOS chip and a MEMS chip. The MEMS chip includes a port exposed to the environment. The MEMS device further includes a printed circuit board (PCB) with an aperture, wherein the MEMS-CMOS module is directly mounted on the PCB.
Public/Granted literature
- US20150146887A1 MICROPHONE ON PRINTED CIRCUIT BOARD (PCB) Public/Granted day:2015-05-28
Information query
