Invention Grant
- Patent Title: Multi-stacked electronic device with defect-free solder connection
- Patent Title (中): 多层电子器件，无缺陷焊接
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Application No.: US14332776Application Date: 2014-07-16
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Publication No.: US09392691B2Publication Date: 2016-07-12
- Inventor: Ai Kiar Ang , Michael Lauri
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Damion Josephs, Esq.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H05K1/11 ; H05K1/18 ; H05K3/32 ; H05K3/34 ; H05K1/14
Abstract:
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
Public/Granted literature
- US20160021750A1 MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION Public/Granted day:2016-01-21
Information query
IPC分类:
