There is provided an electronic component module capable of increasing the degree of integration by mounting electronic components on both surfaces of a substrate. The electronic component module according to an exemplary embodiment of the present disclosure includes a first substrate having one surface on which at least one electronic component is mounted; and a second substrate bonded to one surface of the first substrate and including at least one component accommodating part in which the at least one electronic component is accommodated, wherein the second substrate includes a core layer, and metal wiring layers formed on both surfaces of the core layer and having a plurality of electrode pads.