Invention Grant
- Patent Title: Method of manufacturing surface mount device
- Patent Title (中): 表面贴装装置的制造方法
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Application No.: US14792713Application Date: 2015-07-07
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Publication No.: US09392702B2Publication Date: 2016-07-12
- Inventor: Takeshi Okuyama , Toshihiro Kusagaya , Tohru Yamakami
- Applicant: FUJITSU COMPONENT LIMITED
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2011-018488 20120131
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K3/06 ; H05K3/34 ; H01R4/02 ; H01R12/57 ; H01R12/72 ; H01R13/6587 ; H05K1/02
Abstract:
Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.
Public/Granted literature
- US20150313024A1 SURFACE MOUNT DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-10-29
Information query
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