Invention Grant
- Patent Title: Assembly process for glue-free hinge
- Patent Title (中): 无胶铰链装配工艺
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Application No.: US14099653Application Date: 2013-12-06
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Publication No.: US09394733B2Publication Date: 2016-07-19
- Inventor: Jeremy C. Franklin , Andrew D. Lauder , Brian Bentrim , Haibing Zhu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: F16D1/072
- IPC: F16D1/072 ; E05D5/12

Abstract:
Glue-free hinge assemblies including press-fit pins are disclosed. A press-fit pin of one material can mechanically attach to a workpiece of another material during a press fit operation. The press-fit pin can include a pin shaft having a chamfered first end, a notched portion, a grooved portion having axial grooves, a clinching feature, and a sealing feature. The chamfered first end can guide the press-fit pin into a counter-bored receiving hole in the workpiece. The axial grooves can etch the workpiece material to rotationally lock the press fit-pin into the receiving hole. The clinching feature can plastically deform workpiece material into the notched portion to axially lock the press-fit pin into receiving hole without causing substantial axial expansion of the workpiece. The sealing feature can form a stepped fit between an outer diameter of the press-fit pin and an outer diameter of the counter-bored receiving hole.
Public/Granted literature
- US20140215758A1 ASSEMBLY PROCESS FOR GLUE-FREE HINGE Public/Granted day:2014-08-07
Information query
IPC分类: