Invention Grant
- Patent Title: Electrical connection assembly and testing method thereof
- Patent Title (中): 电气连接组装及其测试方法
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Application No.: US14019475Application Date: 2013-09-05
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Publication No.: US09395401B2Publication Date: 2016-07-19
- Inventor: Yau-Chen Jiang , Defa Wu , Jianbin Yan , Shaoting Lin , Tsai-Kuei Wei , Xiaoxin Bai , Caijin Ye
- Applicant: TPK TOUCH SOLUTIONS (XIAMEN) INC.
- Applicant Address: CN Xiamen
- Assignee: TPK Touch Solutions (Xiamen) Inc.
- Current Assignee: TPK Touch Solutions (Xiamen) Inc.
- Current Assignee Address: CN Xiamen
- Agent Gokalp Bayramoglu; Paul Bendemire
- Priority: CN201210326367 20120906; CN201310283682 20130708
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R31/00 ; G01R31/04 ; G01R31/28 ; G01R1/073 ; G01R31/02

Abstract:
An electrical connection assembly is disclosed. The electrical connection assembly includes a first circuit board and a second circuit board. The first circuit board has a plurality of first signal electrodes and at least one first test electrode, wherein the first signal electrodes and the first test electrode are arranged in a spaced manner on the same side of the first circuit board. The second circuit board has a plurality of second signal electrodes and at least one second test electrode, wherein the second signal electrodes and the second test electrode are arranged in a spaced manner on the same side of the second circuit board, wherein the first signal electrodes are electrically connected to the second signal electrodes and the first test electrode is electrically connected to the second test electrode to form a testing loop.
Public/Granted literature
- US20140062501A1 ELECTRICAL CONNECTION ASSEMBLY AND TESTING METHOD THEREOF Public/Granted day:2014-03-06
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