Invention Grant
- Patent Title: Neurostimulation lead with stiffened proximal array
- Patent Title (中): 神经刺激带有加强的近端阵列
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Application No.: US11963650Application Date: 2007-12-21
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Publication No.: US09399127B2Publication Date: 2016-07-26
- Inventor: Matthew Braden Flowers , John Michael Barker
- Applicant: Matthew Braden Flowers , John Michael Barker
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Lowe Graham Jones PLLC
- Agent Bruce E. Black
- Main IPC: A61N1/05
- IPC: A61N1/05 ; A61M25/00

Abstract:
An implantable electrical lead is provided. The electrical lead comprises an electrically insulative, flexible, elongated lead body having a proximal end and a distal end, an electrical contact carried by the distal end of the lead body, an electrical terminal carried by the proximal end of the lead body, an electrical conductor axially extending within the lead body between the electrical contact and the electrical terminal, and a stiffening tube extending within the proximal end of the lead body from a point proximal to the terminal to a point distal to the terminal and proximal to the electrode. An implantable lead assembly kit comprises the implantable electrical lead, and a connector configured for firmly receiving the proximal end of the lead body. A method of implanting the electrical lead comprises introducing the electrical lead into a patient.
Public/Granted literature
- US20090222073A1 NEUROSTIMULATION LEAD WITH STIFFENED PROXIMAL ARRAY Public/Granted day:2009-09-03
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