Invention Grant
- Patent Title: Polishing apparatus
- Patent Title (中): 抛光设备
-
Application No.: US14549744Application Date: 2014-11-21
-
Publication No.: US09399276B2Publication Date: 2016-07-26
- Inventor: Keisuke Sakata
- Applicant: Ebara Corporation
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2013-245970 20131128
- Main IPC: B24B37/00
- IPC: B24B37/00 ; B24B37/013

Abstract:
A polishing apparatus which can perform power supply, signal transmission, and communication in a non-contact type to respective equipments in a polishing head and/or a polishing table by providing a non-contact type transmission connector having no physical contact point on at least one of the polishing head and the polishing table is disclosed. The polishing apparatus includes a non-contact transmission connector provided on at least one of the polishing table and the polishing head and configured to transfer electric power or signals or to perform communication between a stationary unit and a rotating unit which face each other in a non-contact manner. The electric power or the signals are transmitted or communication is performed between equipment provided in at least one of the polishing table and the polishing head, and the outside of the polishing table or the polishing head through the non-contact transmission connector.
Public/Granted literature
- US20150151400A1 POLISHING APPARATUS Public/Granted day:2015-06-04
Information query