Invention Grant
- Patent Title: Polishing apparatus and polishing method
- Patent Title (中): 抛光设备和抛光方法
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Application No.: US14672003Application Date: 2015-03-27
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Publication No.: US09399277B2Publication Date: 2016-07-26
- Inventor: Hiroshi Yoshida , Makoto Fukushima , Hozumi Yasuda
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2014-072965 20140331; JP2014-229169 20141111
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; B24B37/10 ; B24B37/34 ; H01L21/02 ; H01L21/67
Abstract:
A polishing apparatus capable of performing multi-stage polishing of a substrate, such as wafer, is disclosed. The polishing apparatus includes: a plurality of polishing tables each for supporting a polishing pad; a plurality of polishing heads each configured to press a substrate against the polishing pad; and a transporting device configured to transport the substrate to at least two of the plurality of polishing heads. The plurality of polishing heads have different structures.
Public/Granted literature
- US20150311097A1 POLISHING APPARATUS AND POLISHING METHOD Public/Granted day:2015-10-29
Information query
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