Invention Grant
- Patent Title: Ultrasonic joining method and ultrasonic joining device
- Patent Title (中): 超声波接合方法和超声波接合装置
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Application No.: US14561411Application Date: 2014-12-05
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Publication No.: US09399332B2Publication Date: 2016-07-26
- Inventor: Ulrich Wieduwilt
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Michael Best & Friedrich LLP
- Priority: DE102013225745 20131212
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B31F5/00 ; B29C65/08

Abstract:
An ultrasonic joining method for bonding paper material (5), in particular paper, paperboard or cardboard, comprising the following steps: introducing the paper material (5) into a gap (4) between an ultrasonic horn (2) and an anvil (3), applying a joining force in a joining force direction (6) to the paper material (5) in the gap (4), and setting the ultrasonic horn (2) into an ultrasonic vibration in order to join the paper material (5), characterized in that an ultrasonic frictional welding operation is carried out, in which the joining force direction (6) is not parallel to the direction of vibration (7) of the ultrasonic vibration.
Public/Granted literature
- US20150165719A1 ULTRASONIC JOINING METHOD AND ULTRASONIC JOINING DEVICE Public/Granted day:2015-06-18
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