Invention Grant
US09399361B2 Stamp face forming apparatus, stamp face forming method, and medium
有权
印模成型装置,印模成型方法和介质
- Patent Title: Stamp face forming apparatus, stamp face forming method, and medium
- Patent Title (中): 印模成型装置,印模成型方法和介质
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Application No.: US14533972Application Date: 2014-11-05
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Publication No.: US09399361B2Publication Date: 2016-07-26
- Inventor: Hirotaka Yuno
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2013-229261 20131105; JP2014-132827 20140627
- Main IPC: B41J2/32
- IPC: B41J2/32 ; B41K1/50 ; B41C1/055 ; B41C1/05 ; B41K1/04

Abstract:
A stamp face forming apparatus includes a stamp face forming part including a plurality of heating elements arranged in a direction along a surface holding a porous stamp face material that can be made non-porous by heating, and a drive circuit for controlling heat generating states of the plurality of heating elements to form a stamp face on the stamp face material; and a controller for controlling the drive circuit of the stamp face forming part by adjusting a signal to be applied to the drive circuit such that an amount of heat per dot for a dot to be heated directly adjacent to a dot to be non-heated is less than an amount of heat per dot for a dot to be heated not directly adjacent to the dot to be non-heated in image data for forming the stamp face.
Public/Granted literature
- US20150122140A1 STAMP FACE FORMING APPARATUS, STAMP FACE FORMING METHOD, AND MEDIUM Public/Granted day:2015-05-07
Information query
IPC分类: