Invention Grant
- Patent Title: Adjustable module lift frame assembly
- Patent Title (中): 可调模块升降架总成
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Application No.: US14555976Application Date: 2014-11-28
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Publication No.: US09399564B2Publication Date: 2016-07-26
- Inventor: Ulrich (Rick) Hermann
- Applicant: PCL INDUSTRIAL MANAGEMENT INC.
- Applicant Address: CA Edmonton, Alberta
- Assignee: PCL INDUSTRIAL MANAGEMENT INC.
- Current Assignee: PCL INDUSTRIAL MANAGEMENT INC.
- Current Assignee Address: CA Edmonton, Alberta
- Agency: Bennett Jones LLP
- Main IPC: B66C1/16
- IPC: B66C1/16

Abstract:
A module lift assembly includes a lift assembly, a pair of transversely spaced apart longitudinal lift beams and slings connecting the lift assembly to the lift beams. Each of slings is pivotally connected to the lift assembly and the connected lift beam, and is composed of pivotally connected elongate segments. Pivoting of the segments relative to each other, the lift assembly and the lift beams allows the lift assembly to be lowered and raised relative to the lift beams.
Public/Granted literature
- US20150291398A1 ADJUSTABLE MODULE LIFT FRAME ASSEMBLY Public/Granted day:2015-10-15
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