Invention Grant
- Patent Title: Microelectromechanical component and method for testing a microelectromechanical component
- Patent Title (中): 微机电元件和微机电元件测试方法
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Application No.: US13981506Application Date: 2012-01-27
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Publication No.: US09399572B2Publication Date: 2016-07-26
- Inventor: Bernd Burchard , Michael Doelle
- Applicant: Bernd Burchard , Michael Doelle
- Applicant Address: DE Dortmund
- Assignee: Elmos Semiconductor AG
- Current Assignee: Elmos Semiconductor AG
- Current Assignee Address: DE Dortmund
- Agency: Bejin Bieneman PLC
- Priority: EP11152566 20110128
- International Application: PCT/EP2012/051336 WO 20120127
- International Announcement: WO2012/101257 WO 20120802
- Main IPC: G01L27/00
- IPC: G01L27/00 ; B81B3/00 ; B81C99/00 ; G01L25/00

Abstract:
The microelectromechanical component has a semiconductor substrate (1), which has a cavity (2a) formed in the semiconductor substrate. The cavity is covered by a reversibly deformable membrane (2). A sensor (17) for detecting a deformation of the membrane (2) is formed within the region of the membrane (2). A test actuator (28, 29, 30) for deforming the membrane (2) for testing purposes is also arranged within the region of the membrane (2). Finally, the microelectromechanical component has an evaluation and activation unit (41) connected to the sensor (17) and the test actuator (28, 29, 30) for activating the test actuator (28, 29, 30) in order to deform the membrane (2) as a test and for evaluating a measurement signal of the sensor (17) as a sensor detection of a deformation of the membrane (2) as a result of the activation of the test actuator (28, 29, 30).
Public/Granted literature
- US20130305804A1 MICROELECTROMECHANICAL COMPONENT AND METHOD FOR TESTING A MICROELECTROMECHANICAL COMPONENT Public/Granted day:2013-11-21
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