Invention Grant
- Patent Title: MEMS package and a method for manufacturing the same
- Patent Title (中): MEMS封装及其制造方法
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Application No.: US14632428Application Date: 2015-02-26
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Publication No.: US09399574B2Publication Date: 2016-07-26
- Inventor: Peter V. Loeppert , Denise P. Czech , Lawrence A. Grunert , Kurt B. Friel , Qing Wang
- Applicant: Knowles Electronic LLC
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics LLC
- Current Assignee: Knowles Electronics LLC
- Current Assignee Address: US IL Itasca
- Agency: Lathrop & Gage LLP
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00 ; H01L21/56 ; H01L23/00
Abstract:
A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.
Public/Granted literature
- US20150166335A1 MEMS Package And A Method For Manufacturing The Same Public/Granted day:2015-06-18
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