Invention Grant
US09399725B2 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same
有权
用于半导体晶片的临时粘合剂以及使用其的半导体器件的制造方法
- Patent Title: Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same
- Patent Title (中): 用于半导体晶片的临时粘合剂以及使用其的半导体器件的制造方法
-
Application No.: US13126999Application Date: 2010-06-15
-
Publication No.: US09399725B2Publication Date: 2016-07-26
- Inventor: Etsu Takeuchi , Junya Kusunoki , Hiromichi Sugiyama , Toshiharu Kuboyama , Masakazu Kawata
- Applicant: Etsu Takeuchi , Junya Kusunoki , Hiromichi Sugiyama , Toshiharu Kuboyama , Masakazu Kawata
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO BAKELITE CO., LTD.
- Current Assignee: SUMITOMO BAKELITE CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-142688 20090615; KR10-2009-0059142 20090630; EP09175311 20091106
- International Application: PCT/JP2010/060080 WO 20100615
- International Announcement: WO2010/147102 WO 20101223
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469 ; C09J169/00 ; C09D177/00 ; C09D179/08 ; H01L21/683
Abstract:
To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this.A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.
Public/Granted literature
Information query
IPC分类:
