Invention Grant
- Patent Title: Liquid compositions and methods of fabricating a semiconductor device using the same
- Patent Title (中): 液体组合物和使用其制备半导体器件的方法
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Application No.: US14312782Application Date: 2014-06-24
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Publication No.: US09399822B2Publication Date: 2016-07-26
- Inventor: Dong-Min Kang , Hyungjun Jeon , Ingoo Kang , Jeong Kwon , Jung-ig Jeon , Jungsik Choi , Young Taek Hong , Akira Hosomi , Tomoko Suzuki
- Applicant: Samsung Electronics Co., Ltd. , Samyoung Pure Chemicals Co., Ltd. , Mitsubishi Gas Chemical Company, Inc.
- Applicant Address: KR KR JP
- Assignee: Samsung Electronics Co., Ltd.,Samyoung Pure Chemicals Co., Ltd.,Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Samsung Electronics Co., Ltd.,Samyoung Pure Chemicals Co., Ltd.,Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: KR KR JP
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2013-0111882 20130917
- Main IPC: H01L21/44
- IPC: H01L21/44 ; C23F1/18 ; H01L21/3213 ; H01L23/00
Abstract:
The present inventive concepts provide a liquid composition for etching a metal containing copper. The liquid composition may include hydrogen peroxide in a range of about 0.1 wt % to about 10 wt % and a buffer solution in a range of about 0.1 wt % to about 10 wt %. The buffer solution may include citrate. The liquid composition may have a pH in a range of about 4.0 to about 7.0.
Public/Granted literature
- US20150079782A1 LIQUID COMPOSITIONS AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2015-03-19
Information query
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