Invention Grant
- Patent Title: Method and system for magnetic semiconductor solid state cooling
- Patent Title (中): 磁性半导体固态冷却方法与系统
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Application No.: US14404740Application Date: 2013-05-30
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Publication No.: US09400127B2Publication Date: 2016-07-26
- Inventor: Guillaume Gervais , Thomas Szkopek , Jonathan Guillemette
- Applicant: The Royal Institution for the Advancement of Learning/McGill University
- Applicant Address: CA Montreal
- Assignee: The Royal Institution for the Advancement of Learning/McGill University
- Current Assignee: The Royal Institution for the Advancement of Learning/McGill University
- Current Assignee Address: CA Montreal
- Agency: The Law Office of Michael E. Kondoudis
- International Application: PCT/CA2013/000524 WO 20130530
- International Announcement: WO2013/177678 WO 20131205
- Main IPC: F25B21/00
- IPC: F25B21/00 ; H01L23/38 ; H01L35/28 ; H01L23/373 ; H01L23/34

Abstract:
Cryogenic electronics based upon semiconductive devices, superconductive devices, or a combination of the two present opportunities for a wide variety of novel, fast, and low power devices. However, such cryogenic electronics require cooling which is typically achieved through fluid refrigerants such as liquid nitrogen or liquid helium. Solid state refrigeration based upon adiabatic demagnetization in paramagnetic salts offers one alternative but requires that the solid state cooler and cryogenic electronic circuits be different physical elements. The inventors present solid state cooling for semiconductor materials including but not limited to silicon. Beneficially active electronic devices can be integrated monolithically with solid state semiconductor coolers exhibiting magnetic cooling within the whole substrate or predetermined regions of the substrate. Alternatively, active devices may be formed with semiconductor layers integral to them that exhibit magnetic cooling.
Public/Granted literature
- US20150143817A1 METHOD AND SYSTEM FOR MAGNETIC SEMICONDUCTOR SOLID STATE COOLING Public/Granted day:2015-05-28
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