Invention Grant
- Patent Title: Stress reduction components for sensors
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Application No.: US14861936Application Date: 2015-09-22
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Publication No.: US09400287B2Publication Date: 2016-07-26
- Inventor: Ryan Roehnelt , Michael Jarvis , Galen P. Magendanz
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: G01P15/00
- IPC: G01P15/00 ; G01P1/00 ; G01P15/125 ; G01P15/13

Abstract:
An accelerometer device for reducing stress on the sensor resulting from temperature extremes and multiple coefficients of thermal expansion. An exemplary accelerometer device includes upper and lower stators and a reed. The reed includes a support ring and a paddle that is flexibly connected to the support ring. The support ring includes a ring section and at least two mounting devices. The mounting devices are at least partially mechanically isolated from the ring section. The ring section flexibly receives the paddle. The mounting devices include a pad area and a neck area that connect the pad area to the ring section. The neck area includes a width dimension that is narrower than a diameter dimension of the pad area.
Public/Granted literature
- US20160011227A1 STRESS REDUCTION COMPONENTS FOR SENSORS Public/Granted day:2016-01-14
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