Invention Grant
- Patent Title: Integrated circuit test temperature control mechanism
- Patent Title (中): 集成电路测试温度控制机制
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Application No.: US13600486Application Date: 2012-08-31
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Publication No.: US09400291B2Publication Date: 2016-07-26
- Inventor: John C. Johnson , James G. Maveety , Abram M. Detofsky , James E. Neeb
- Applicant: John C. Johnson , James G. Maveety , Abram M. Detofsky , James E. Neeb
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R1/44 ; H05K7/20 ; G01R31/28 ; G01R31/26 ; G01R1/04
Abstract:
A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.
Public/Granted literature
- US20140062513A1 Integrated Circuit Test Temperature Control Mechanism Public/Granted day:2014-03-06
Information query
