Invention Grant
- Patent Title: Supporting assembly with a rolling ball disposed directly below supporting rods and method for using the same
- Patent Title (中): 支撑组件具有直接位于支撑杆下方的滚动球及其使用方法
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Application No.: US14138150Application Date: 2013-12-23
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Publication No.: US09400431B2Publication Date: 2016-07-26
- Inventor: Chien-Ju Wu , Ming-Sung Wu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: F16L3/10
- IPC: F16L3/10 ; G03F7/20 ; H01L21/308 ; F16L3/01 ; F16L3/223
Abstract:
A supporting assembly configured to support a plurality of tubes includes a first supporting rod, a second supporting rod opposite to the first supporting rod, a bridging member, and a rolling member. The first supporting rod includes several first parallel recesses. The bridging member is connected to one end of the first supporting rod or one end of the second supporting rod. The rolling member is received by the bridging member.
Public/Granted literature
- US20150176725A1 SUPPORTING ASSEMBLY AND METHOD FOR USING THE SAME Public/Granted day:2015-06-25
Information query
