Invention Grant
- Patent Title: Air channel in storage media for chassis thermal design
- Patent Title (中): 存储介质中的空气通道用于底盘散热设计
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Application No.: US14465465Application Date: 2014-08-21
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Publication No.: US09400532B2Publication Date: 2016-07-26
- Inventor: Haesung Kwon , Eric M. Tunks
- Applicant: Dell Products, LP
- Applicant Address: US TX Round Rock
- Assignee: DELL PRODUCTS, LP
- Current Assignee: DELL PRODUCTS, LP
- Current Assignee Address: US TX Round Rock
- Agency: Larson Newman, LLP
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F1/18

Abstract:
A storage device includes a first portion including drive media, and a second portion. The second portion includes a first end wall that is in physical communication with first and second side walls, and a second end wall that is in physical communication with the first and second side walls. The second portion also includes a printed circuit board mounted within the cavity, a plurality of ribs within the cavity, and an air channel within the cavity. The air channel has a lower air flow impedance than other portions of the storage device including the first portion, the printed circuit board, and the ribs. The air channel extends along a direction between the first end wall and the second end wall of the storage device.
Public/Granted literature
- US20160054768A1 Air Channel in Storage Media for Chassis Thermal Design Public/Granted day:2016-02-25
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