Invention Grant
- Patent Title: Defect analysis system for error impact reduction
- Patent Title (中): 缺陷分析系统降低误差
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Application No.: US14809395Application Date: 2015-07-27
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Publication No.: US09400735B2Publication Date: 2016-07-26
- Inventor: Wei Huang , Jian Li , Su Liu , Shunguo Yan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: DeLizio Law, PLLC
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G06F11/36 ; G06F11/07 ; G06F9/44

Abstract:
A first set of data associated with a plurality of data sources is analyzed to determine a plurality of relationships among the first set of data. First rules are generated first rules based, at least in part, on the first set of data, wherein a first of the first rules indicates a first software defect and a cause of the first software defect, wherein a second of the first rules indicates a solution to the first software defect. Determining that the solution to the first software defect is a possible solution to a second software defect is made based, at least in part, on the first and second of the first rules. An indication that first set of data has been modified is received. A relationship between the first set of data and a second set of data associated with the plurality of data sources is determined.
Public/Granted literature
- US20150331780A1 DEFECT ANALYSIS SYSTEM FOR ERROR IMPACT REDUCTION Public/Granted day:2015-11-19
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