Invention Grant
- Patent Title: Post package repair device
- Patent Title (中): 邮包修理装置
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Application No.: US14684608Application Date: 2015-04-13
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Publication No.: US09401227B2Publication Date: 2016-07-26
- Inventor: Young Kyu Noh
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2014-0183247 20141218
- Main IPC: G11C17/00
- IPC: G11C17/00 ; G11C29/00 ; G11C17/16 ; G11C17/18
Abstract:
A post package repair device may include a plurality of bank groups, each of the plurality of bank groups including fuses indicating repair information, configured to share a predetermined number of fuses. The post package repair device may include a resource detection unit configured to determine the availability of the fuses from among the plurality of bank groups.
Public/Granted literature
- US20160180969A1 POST PACKAGE REPAIR DEVICE Public/Granted day:2016-06-23
Information query
