Invention Grant
- Patent Title: Composite electronic component and composite electronic component manufacturing method
- Patent Title (中): 复合电子元器件及复合电子元件制造方法
-
Application No.: US14491741Application Date: 2014-09-19
-
Publication No.: US09401242B2Publication Date: 2016-07-26
- Inventor: Tomohiro Kido , Miho Kitamura , Kazutaka Watanabe
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2013-212030 20131009
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/24 ; H01F17/00 ; H01F41/04
Abstract:
A composite electronic component includes a multilayer body, coils, an antistatic element and outer electrodes. The multilayer body is configured by laminating insulator layers. The coils are provided on the upper surfaces of the insulator layers. The antistatic element is connected to the coils and includes ground electrodes. The outer electrodes are connected to the coils. The upper surfaces of the insulator layers on which the coils are provided do not intersect with the ground electrodes.
Public/Granted literature
- US20150097648A1 COMPOSITE ELECTRONIC COMPONENT AND COMPOSITE ELECTRONIC COMPONENT MANUFACTURING METHOD Public/Granted day:2015-04-09
Information query
