Invention Grant
- Patent Title: Conductive paste, multilayer ceramic electronic component, and method for manufacturing same
- Patent Title (中): 导电糊，多层陶瓷电子元件及其制造方法
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Application No.: US14569841Application Date: 2014-12-15
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Publication No.: US09401244B2Publication Date: 2016-07-26
- Inventor: Toshihiro Suzuki , Naoaki Ogata , Masahito Ishikawa
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2012-135609 20120615
- Main IPC: H01B1/22
- IPC: H01B1/22 ; B05D5/12 ; H01G4/30 ; C09D11/037 ; C09D11/106 ; C09D11/52 ; C09D5/24 ; H01G2/06 ; H01G4/012 ; H01G4/248 ; H01G4/008 ; H01G4/232 ; H05K1/09 ; H05K3/46 ; H01G4/12
Abstract:
A conductive paste that includes a (meth)acrylic resin serving as a binder resin, an organic solvent, and a metal powder. The (meth)acrylic resin has a glass transition point Tg in the range of −60° C. to 120° C., a hydroxyl group content in the range of 0.01% to 5% by weight per molecule, an acid value in the range of 1 to 50 mgKOH/g, and a weight-average molecular weight in the range of 10,000 to 350,000 Mw.
Public/Granted literature
- US20150098165A1 CONDUCTIVE PASTE, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING SAME Public/Granted day:2015-04-09
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