Invention Grant
- Patent Title: Fuse structure
- Patent Title (中): 保险丝结构
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Application No.: US14446789Application Date: 2014-07-30
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Publication No.: US09401258B2Publication Date: 2016-07-26
- Inventor: Chen-Ming Hung , Yun-Han Chen , Shao-Tung Peng , Shao-Yu Chou , Yue-Der Chih , Li-Chun Tien
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01H85/055
- IPC: H01H85/055

Abstract:
A fuse structure comprises a first conductive layer on a first level. The first conductive layer comprises a fuse line extending in a first direction. The fuse line has a first end portion, a second end portion opposite the first end portion, and a fuse link portion connecting the first end portion and the second end portion. The first conductive layer also comprises lines parallel to the fuse line, the lines being aligned in the first direction and being separated from one another by a first distance measured in the first direction. The fuse structure also comprises a second conductive layer on a second level different from the first level and coupled with the first conductive layer. The second conductive layer has parallel lines extending in a second direction, the parallel lines being separated by a second distance measured in a third direction orthogonal to the second direction.
Public/Granted literature
- US20160035527A1 FUSE STRUCTURE Public/Granted day:2016-02-04
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