Invention Grant
- Patent Title: Support for semiconductor substrate
- Patent Title (中): 支持半导体衬底
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Application No.: US13825769Application Date: 2011-09-26
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Publication No.: US09401299B2Publication Date: 2016-07-26
- Inventor: Ralph Sowden , Kevin Barr , Matthew Laberge , Troy Palm , Dennis Benson
- Applicant: Ralph Sowden , Kevin Barr , Matthew Laberge , Troy Palm , Dennis Benson
- Applicant Address: US MA Wilmington
- Assignee: Rudolph Technologies, Inc.
- Current Assignee: Rudolph Technologies, Inc.
- Current Assignee Address: US MA Wilmington
- Agency: Dicke, Billig & Czaja, PLLC
- International Application: PCT/US2011/053263 WO 20110926
- International Announcement: WO2012/040705 WO 20120329
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/68 ; H01L21/687
Abstract:
A moveable semiconductor substrate support includes a control device receiving data from one or more sensors and providing control signals to one or more actuators. The control device is coupled to and moves with the moveable substrate support to facilitate flexible and complex operation of the substrate support itself.
Public/Granted literature
- US20130330154A1 SUPPORT FOR SEMICONDUCTOR SUBSTRATE Public/Granted day:2013-12-12
Information query
IPC分类:
