Air gaps structures for damascene metal patterning

Invention Grant

US09401305B2 Air gaps structures for damascene metal patterning 有权

Title translation: 用于镶嵌金属图案的气隙结构

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Patent Title: Air gaps structures for damascene metal patterning
Patent Title (中): 用于镶嵌金属图案的气隙结构
Application No.: US14533839

Application Date: 2014-11-05
Publication No.: US09401305B2

Publication Date: 2016-07-26
Inventor: Yuji Takahashi , Takuya Futase , Yoko Furihata , Satoshi Kamata
Applicant: SanDisk Technologies Inc.
Applicant Address: US TX Plano
Assignee: SanDisk Technologies LLC
Current Assignee: SanDisk Technologies LLC
Current Assignee Address: US TX Plano
Agency: Davis Wright Tremaine LLP
Main IPC: H01L21/8239
IPC: H01L21/8239 ; H01L21/764 ; H01L21/768 ; H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L27/115 ; H01L21/311 ; H01L21/8247

Air gaps structures for damascene metal patterning

Abstract:

A pattern of parallel lines defines first regions where no conductive material is to be located, a distance between adjacent lines in the first regions being smaller than a predetermined distance, and defines second regions where conductive material is to be located, a distance between adjacent lines in the second regions being larger than the predetermined distance. A subsequent layer caps air gaps between lines in the first regions. Conductive material is then deposited and planarized to form lines of conductive material in the second regions.

Abstract(Chinese):

平行线的图案限定不存在导电材料的第一区域，第一区域中的相邻线之间的距离小于预定距离，并且限定导电材料要被定位的第二区域，相邻线之间的距离在第二区域中大于预定距离。随后的层覆盖第一区域中的线之间的空气间隙。然后将导电材料沉积并平坦化以在第二区域中形成导电材料线。

Public/Granted literature

US20160126130A1 Air Gaps Structures for Damascene Metal Patterning Public/Granted day:2016-05-05

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8239	........存储器结构