Packaging devices, methods of manufacture thereof, and packaging methods are disclosed. In some embodiments, a packaging device includes a first substrate including a post passivation interconnect (PPI) structure including a PPI pad disposed thereon, and a second substrate including a contact pad disposed thereon. A conductive bump is coupled between the PPI pad and the contact pad. A molding material is disposed over portions of the PPI structure proximate the conductive bump. A top surface of the molding material contacts the conductive bump at a height of the conductive bump having a width C, and the contact pad has a width B. A ratio R of C:B comprises about 1.0 or greater.